Using high-speed, precision pick & place machines, our surface mount technology (SMT) lines are capable of installing surface mount devices (SMDs) as small as size 0201, ICs with fine pitch down to 0.4 mm as well as micro-BGAs and LGAs with great accuracy.

We solder single- and double-sided SMD modules using reflow technology. For particularly challenging modules and backplanes, we use a vapor-phase soldering machine.

For a no-clean soldering process using nitrogen and for automatic partial soldering, we use wave soldering systems and selective soldering robots. We also possess special expertise in the area of backplane production.

For manual through hole technology (THT) assembly, we have laser-guided, programmable, CAD-compatible placement workbenches (inline operation with the wave soldering systems).