In surface mount technology (SMT), electronic components (surface mount devices, SMDs) are connected directly to the PCB by means of solderable contact surfaces on the bottom of the components and soldering paste applied previously to the PCB.
SMT components can be used alone on pure SMT boards or combined with components with leads (through hole technology, THT). Printed circuit boards can have mixed SMT and THT, or just SMT or THT.
Due to the lack of connecting leads, SMD modules can be packed more densely with components, which can be installed on both sides of the board.
SMD components are stocked in belts, magazines or blister trays. Pick and place machines place them on the PCB which has been provided with soldering paste using screen or stencil printing.
The actual soldering process involves heating the printed module in a reflow or vapor phase soldering oven.
VIERLING has a rework station for repairing modules with complex SMD components such as ball grid arrays (BGAs) and quad flat packs (QFPs). This station is used to unsolder selected faulty components and replace them.
SMT equipment at VIERLING
- Fully automated soldering paste printers
- SMD placement machines
- SMD bonding station
- Reflow soldering ovens (convection reflow ovens, with and without nitrogen)
- Vapor phase soldering oven
- Rework station for complex SMD components (BGAs und QFPs)
Using our state-of-the-art technology, we are able to produce everything from challenging individual items through lot sizes of up to one million units at internationally competitive prices.
Andreas Lebrecht, Director Manufacturing